Bulk Processes

Robert Bosch offers all standard Micro System Technology Processes for Silicon and Silicon Glass structures including:

• High Rate Trench etching ("The Bosch Process"): Fast and selective etch of vertical side walls with aspect ratio up to 20:1.
• Wet Chemical Etching: Etching silicon wafers from the backside using an acidic or alkaline etching bath. Standard method for manufacturing of caverns and membranes
• Wafer Grinding: Adjusting the initial wafer thickness to specific needs
• Chemical Mechanical Polishing: Removal of sub-surface damaged zone created by grinding processes.
• Anodic Wafer Bonding: Connection of silicon and glass in a stable and hermetic manner to produce double and triple wafer stacks. Both, silicon or glass wafer may be structured thus giving the possibility to form microfluidic structures
• Electrochemical etching: Creation of porous silicon

Additional information on available non-standard processes and a detailed process catalogue of the Robert Bosch Bulk Micromachining capabilities is available upon signature of a Non Disclosure Agreement.